The Indian government is accelerating semiconductor manufacturing, research, and skill development under the Semicon India Programme with an outlay of Rs 760.00 billion. It provides 51 per cent fiscal support for projects related to chip fabrication, display fabs, compound semiconductors, and semiconductor assembly (ATMP/OSAT). Product Design Linked Incentives further support chip design.

Key initiatives: - Rs 1520.00 billion investment in five semiconductor manufacturing projects (1 fabrication, 4 ATMP/OSAT).

- MoUs with USA, EU, Japan, and Singapore to boost semiconductor collaboration.

- Skill Development Initiatives:

- AICTE introduced new VLSI and IC manufacturing curricula.

- Chips to Startup (C2S) Programme aims to train 85,000 engineers in VLSI and embedded systems.

- SMART Lab at NIELIT Calicut targets 0.1 million engineers in five years, training 42,000+ so far.

- MoUs for talent development with IISc & Lam Research (60,000 engineers in 10 years), IBM, and Purdue University.

The government is also modernising the Semi-Conductor Laboratory (Mohali) and funding R&D in chip design, nanotechnology, and semiconductor processes to enhance India’s self-reliance in semiconductor technology.