TRUMPF and SCHMID Group have developed an innovative manufacturing process that replaces silicon with glass in advanced microchip packaging, reducing costs and boosting efficiency.

This breakthrough process, aimed at high-end chips for AI, smartphones, and smartwatches, enables manufacturers to use glass interposers instead of silicon, significantly lowering production costs.

TRUMPF’s laser technology, combined with SCHMID’s etching expertise, ensures precise through-glass vias (TGVs), a key requirement in chip production. Their approach accelerates process times tenfold, allowing millions of precise connections per panel.

Industry experts foresee a $96 billion market for advanced microchip packaging by 2030, with AI applications driving future demand. This collaboration positions TRUMPF and SCHMID at the forefront of next-gen semiconductor manufacturing.