HCL Group is one of the firms that has applied to set up electronic chip operations under the "Scheme for Compound Semiconductors," and HCL Technologies will help HCL Corporate with chip processing from start to finish.

"One of HCL Technologies' main sectors, particularly in engineering services, is semi-chip. Our goal is to more than double our business. There is an internal goal to complete it in three to four years. I say only three to four because it is ongoing and we see demand enough to do that," said HCL Technologies executive vice president and BU head Ameer Saithu.

He stated that HCL Group's semiconductor wafer fab can be developed within 18-24 months of the government's approval of its proposal.

"We have finances available. To be clear, this is happening from HCL Corporate. From my company's standpoint, HCL Tech, we are interested in establishing skills in that space and see it as a huge opportunity "He stated.

HCL Group intends to establish a chip wafer production plant for 65-nanometer nodes utilised in the automotive, consumer durables, and low-cost device industries.

In electronic chip manufacture, HCL Technologies presently collaborates with semiconductor companies such as Intel, NXP, Taiwan Semiconductor Manufacturing Company (TSMC), and Applied Materials.

HCL's semiconductor plant, according to Saithu, will assist HCL Technologies complete its end-to-end offering in electronic manufacture.

He stated that global demand for HCL Tech semiconductor services has surged, and the company has begun to establish capabilities in Brazil, Vietnam, Israel, the Netherlands, and Japan, while also expanding manpower in its Bangalore headquarters.

"We are attempting to increase the size of the available pool rather than having the same folks migrate from one location to another. We have also built a large-scale training programme with a variety of consumers working in various skill sets within this industry." Saithu stated.